| 產品類型
|
PCB & PCB HDI ELIC(5+2+5)
|
| PCB層數
|
2L~32L
|
| 板厚度
|
內芯厚度Core thckness:0.05mm-1.5mm
成品厚度 Finished board thickness:0.3mm-3.5mm
|
| 最小孔徑
|
雷射鑽 Laser:0.075mm/3mil
機械鑽 Mechnical:0.15mm/6mil
|
| 最小線寬/線距
|
2.5mil/2.5mil
|
| 銅厚厚度
|
1/3OZ-2OZ
|
| 最大加工SIZE
|
700mm*610mm
|
| 層間對準度
|
+/-0.05mm(2mil)
|
| 外型對準度
|
+/-0.075mm(3mil)
|
| 最小BGA PAD
|
0.15mm(6mil)
|
| 縱橫比
|
10:1
|
| 板彎曲
|
0.50%
|
| 阻抗公差
|
+/-8%
|
| 日加工能力
|
+/-10%
|
| 鍍金厚度
|
3000m2
|
| 表面處理
|
ENIG/OSP/HASL/FINGER GOLD/IMMERSION TIN
|
| 常用基材
|
FR4/NORMAL Tg/HIGH Tg/Low Dk/HF FR4/PTFE/PI
|
